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d a t a sh eet product speci?cation supersedes data of 2002 jan 17 2004 feb 18 integrated circuits tda1517; tda1517p 2 x 6 w stereo power amplifier
2004 feb 18 2 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p features requires very few external components high output power fixed gain good ripple rejection mute/standby switch ac and dc short-circuit safe to ground and v p thermally protected reverse polarity safe capability to handle high energy on outputs (v p =0v) no switch-on/switch-off plop electrostatic discharge protection. general description the tda1517 is an integrated class-b dual output amplifier in a plastic single in-line medium power package with fin (sil9mpf), a plastic rectangular-bent single in-line medium power package with ?n (rbs9mpf) or a plastic heat-dissipating dual in-line package (hdip18). the device is primarily developed for multi-media applications. quick reference data ordering information symbol parameter conditions min. typ. max. unit v p supply voltage 6.0 14.4 18.0 v i orm repetitive peak output current -- 2.5 a i q(tot) total quiescent current - 40 80 ma i sb standby current - 0.1 100 m a i sw switch-on current -- 40 m a | z i | input impedance 50 -- k w p o output power r l =4 w ; thd = 0.5% - 5 - w r l =4 w ; thd = 10% - 6 - w svrr supply voltage ripple rejection f i = 100 hz to 10 khz 48 -- db a cs channel separation 40 -- db g v closed loop voltage gain 19 20 21 db v no(rms) noise output voltage (rms value) - 50 -m v t c crystal temperature -- 150 c type number package name description version tda1517/n3 sil9mpf plastic single in-line medium power package with ?n; 9 leads sot110-1 tda1517/n3/s5 rbs9mpf plastic rectangular-bent single in-line medium power package with ?n; 9 leads sot352-1 tda1517p hdip18 plastic heat-dissipating dual in-line package; 18 leads sot398-1
2004 feb 18 3 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p block diagram fig.1 block diagram. handbook, full pagewidth mute/stand-by switch input mlc351 output 1 15 k w 15 k w x 1 va stand-by switch v p mute switch stand-by reference voltage 18 k w 18 k w 2 k w 60 k w mute switch c m power stage 4 8 mute switch va va c m 2 k w 60 k w power stage 6 275 sgnd signal ground pgnd output 2 non-inverting input 1 non-inverting input 2 9 supply voltage ripple rejection output 3 1 tda1517 mute reference voltage input reference voltage v p power ground (substrate)
2004 feb 18 4 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p pinning symbol pin description - inv1 1 non-inverting input 1 sgnd 2 signal ground svrr 3 supply voltage ripple rejection output out1 4 output 1 pgnd 5 power ground out2 6 output 2 v p 7 supply voltage m/ss 8 mute/standby switch input - inv2 9 non-inverting input 2 fig.2 pin configuration for sot110-1 and sot352-1. handbook, halfpage mlc352 1 2 3 4 5 6 7 8 9 p v out2 sgnd inv1 inv2 tda1517 out1 m/ss svrr pgnd fig.3 pin configuration for sot398-1. pins 10 to 18 should be connected to gnd or floating. handbook, halfpage mlc353 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 p v out2 sgnd inv1 inv2 tda1517p out1 m/ss svrr pgnd functional description the tda1517 contains two identical amplifiers with differential input stages. the gain of each amplifier is fixed at 20 db. a special feature of the device is the mute/standby switch which has the following features: low standby current (<100 m a) low mute/standby switching current (low cost supply switch) mute condition.
2004 feb 18 5 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p limiting values in accordance with the absolute maximum rating system (iec 60134). thermal resistance symbol parameter conditions min. max. unit v p supply voltage operating - 18 v no signal - 20 v v p(sc) ac and dc short-circuit safe voltage - 18 v v p(r) reverse polarity - 6v erg o energy handling capability at outputs v p =0v - 200 mj i osm non-repetitive peak output current - 4a i orm repetitive peak output current - 2.5 a p tot total power dissipation see fig.4 - 15 w t stg storage temperature - 55 +150 c t amb operating ambient temperature - 40 +85 c t c crystal temperature - 150 c symbol type number parameter value unit r th(j-c) tda1517/n3; tda1517/n3/s5 thermal resistance from junction to case 8 k/w r th(j-p) tda1517p thermal resistance from junction to pins 15 k/w r th(j-a) tda1517/n3; tda1517/n3/s5; tda1517p thermal resistance from junction to ambient 50 k/w fig.4 power derating curve. (1) r th j-c = 8 k/w. (2) r th j-p = 15 k/w. handbook, halfpage 25 0 50 150 12 0 mlc354 100 t ( c) o amb p (w) 18 6 (1) (2)
2004 feb 18 6 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p dc characteristics v p = 14.4 v; t amb =25 c; measured in fig.6; unless otherwise speci?ed. note 1. the circuit is dc adjusted at v p = 6 to 18 v and ac operating at v p = 8.5 to 18 v. symbol parameter conditions min. typ. max. unit supply v p supply voltage note 1 6.0 14.4 18.0 v i q(tot) total quiescent current - 40 80 ma v o dc output voltage - 6.95 - v mute/standby switch v 8 switch-on voltage level see fig.5 8.5 -- v mute condition v o output signal in mute position v i(max) =1v; f i =20hzto15khz -- 2mv standby condition i sb dc current in standby condition -- 100 m a v sw switch-on current - 12 40 m a
2004 feb 18 7 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p ac characteristics v p = 14.4 v; r l =4 w ; f = 1 khz; t amb =25 c; measured in fig.6; unless otherwise speci?ed. notes 1. output power is measured directly at the output pins of the ic. 2. frequency response externally fixed. 3. ripple rejection measured at the output with a source impedance of 0 w , maximum ripple amplitude of 2 v (p-p) and a frequency between 100 hz and 10 khz. 4. noise voltage measured in a bandwidth of 20 hz to 20 khz. 5. noise output voltage independent of r s (v i = 0 v). symbol parameter conditions min. typ. max. unit p o output power thd = 0.5%; note 1 4 5 - w thd = 10%; note 1 5.5 6.0 - w thd total harmonic distortion p o =1w - 0.1 - % f lr low frequency roll-off at - 3 db; note 2 - 45 - hz f hr high frequency roll-off at - 1db 20 -- khz g v closed loop voltage gain 19 20 21 db svrr supply voltage ripple rejection note 3 on 48 -- db mute 48 -- db standby 80 -- db | z i | input impedance 50 60 75 k w v no noise output voltage on r s =0 w ; note 4 - 50 -m v on r s =10 w ; note 4 - 70 100 m v mute note 5 - 50 -m v a cs channel separation r s =10 w 40 -- db |d g v | channel unbalance - 0.1 1 db
2004 feb 18 8 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p fig.5 standby, mute and on conditions. handbook, halfpage 8.5 0 mlc355 v 18 6.4 3.3 2 11 (v) on (i = 40 ma) p mute (i = 40 ma) p standby (i 100 m a) p application information fig.6 application circuit diagram. handbook, full pagewidth mlc356 100 nf p v tda1517 87 standby switch 220 nf input 1 1000 m f 1000 m f input reference voltage 2 5 signal ground power ground 1 9 220 nf input 2 4 6 3 2200 m f internal 1/2 v p 100 m f 60 k w 60 k w 20 db 20 db
2004 feb 18 9 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p package outlines unit a a max. 2 a 3 b 1 d 1 b 2 bcd (1) e (1) z max. (1) elpp 1 q 1 q 2 q references outline version european projection issue date iec jedec jeita mm 18.5 17.8 3.7 8.7 8.0 a 4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 q 1.75 1.55 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 sot110-1 95-02-25 03-03-12 0 5 10 mm scale 0.25 w d e a a c a 2 3 a 4 q 1 q 2 l q w m b b 1 b 2 d 1 p q 1 z e 19 p seating plane pin 1 index sil9mpf: plastic single in-line medium power package with fin; 9 leads sot110-1
2004 feb 18 10 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p unit a a max. 2 max. a 3 b 1 d 1 b 2 bcd (2) e (2) z (2) (1) el pp 1 q 1 q 2 q references outline version european projection issue date iec jedec jeita mm 14.45 13.95 8.7 8.0 3.7 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1 5.9 5.7 4.4 4.2 3.8 3.3 15.1 14.9 q 1.75 1.55 dimensions (mm are the original dimensions) notes 1. dimension is specified at seating plane. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 sot352-1 97-12-16 03-03-12 0 5 10 mm scale 0.25 w 0.6 v d e a a c a 2 3 q 1 q 2 q d 1 p q 1 p seating plane pin 1 index l w m v m b b 1 b 2 z e 19 rbs9mpf: plastic rectangular-bent single in-line medium power package with fin; 9 leads sot352-1
2004 feb 18 11 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l references outline version european projection issue date iec jedec jeita mm dimensions (inch dimensions are derived from the original mm dimensions) sot398-1 95-01-25 03-02-13 a min. a max. b max. w m e e 1 1.40 1.14 0.67 0.50 0.47 0.38 21.85 21.35 6.5 6.2 3.9 3.1 0.25 2.54 7.62 8.32 8.02 8.7 7.7 1 4.7 0.51 3.7 inches 0.06 0.04 0.03 0.02 0.02 0.01 1.05 0.75 0.04 0.03 0.87 0.84 0.26 0.24 0.15 0.12 0.01 0.1 0.3 0.33 0.32 0.34 0.30 0.04 0.19 0.02 0.15 m h c (e ) 1 m e w m b 1 b 2 e a a 1 a 2 l seating plane z d e 18 1 10 9 b pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. hdip18: plastic heat-dissipating dual in-line package; 18 leads sot398-1
2004 feb 18 12 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p soldering introduction to soldering through-hole mount packages this text gives a brief insight to wave, dip and manual soldering. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). wave soldering is the preferred method for mounting of through-hole mount ic packages on a printed-circuit board. soldering by dipping or by solder wave driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. suitability of through-hole mount ic packages for dipping and wave soldering methods notes 1. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. for pmfp packages hot bar soldering or manual soldering is suitable. package soldering method dipping wave cpga, hcpga - suitable dbs, dip, hdip, rdbs, sdip, sil suitable suitable (1) pmfp (2) - not suitable
2004 feb 18 13 philips semiconductors product speci?cation 2 x 6 w stereo power ampli?er tda1517; tda1517p data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2004 sca76 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r30/05/pp 14 date of release: 2004 feb 18 document order number: 9397 750 12926

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